Multiphysics Power Module Simulation & Digital Engineering
Seeking a Senior Engineer to drive next-generation virtual product development for advanced power semiconductor packages using multiphysics simulation, machine learning, and digital engineering.
- Munich, Bayern, Germany
- Full-time
- On-site
- Posted Nov 9, 2026
INDUSTRYHardware & ElectronicsSemiconductorsElectrical EngineeringAI & Machine Learning
Responsibilities
- Drive the development of simulation-driven design methodologies for power module technologies.
- Define and implement next-generation virtual product development frameworks.
- Develop technical roadmaps for AI-assisted engineering and simulation automation.
- Act as a technical expert for digital engineering initiatives across global development teams.
- Lead electrical, thermal, mechanical, and coupled multiphysics simulations of advanced power modules.
- Develop and validate simulation methodologies for SiC and GaN package architectures.
- Support technology development through predictive modeling and virtual prototyping.
- Correlate simulation results with experimental data and reliability testing.
- Develop machine learning models for performance prediction, reliability estimation, and design optimization.
- Create surrogate models, reduced-order models, and digital twins of power modules.
- Investigate state-of-the-art AI methodologies.
- Lead multi-objective optimization studies covering performance, cost, reliability, manufacturability, and sustainability.
- Develop automated design synthesis workflows for package architecture exploration.
- Implement uncertainty quantification and robust design methodologies.
- Develop Python-based engineering tools and automated simulation workflows.
- Interface simulation platforms, databases, and AI frameworks.
- Contribute to scalable software solutions supporting engineering productivity.
Requirements
- M.S. or Ph.D. in Electrical Engineering
- Mechanical Engineering
- Physics
- Computational Engineering
- Computer Science
Nice to have: Power Electronics Packaging, SiC and GaN Technologies, Virtual Product Development, Digital Twins, Reliability & Lifetime Prediction
Skills
multiphysics simulationnumerical methodsPythonAnsysmachine learningdata-driven engineeringAnsysPython
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