2.5D/3D integration jobs

Principal Semiconductor Packaging Technologist – Customer Solutions

Advanced Micro Devices, Inc · Posted Nov 10, 2026

San Jose, California, United States

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Principal Packaging Integration Engineer responsible for architecture decisions, customer engagement, and cross‑functional coordination in semiconductor packaging.

Responsibilities

Drive packaging architecture decisions and IC‑PKG‑PCB co‑design for FPGA, embedded SoC, and custom ASIC programs spanning 2.5D/3D, OPC, and MOP technologies.
Lead DFM and DFMEA reviews and packaging supply qualification, partnering with OSAT/substrate suppliers on manufacturable, reliable, application‑ready solutions.
Serve as the primary customer‑facing contact for assigned programs – representing the packaging organization and translating customer requirements into internal technical direction.
Organize and lead cross‑functional task forces across silicon design, packaging, SI/PI, thermal‑mechanical, quality and reliability test, and supply chain to resolve issues, align decisions, and keep programs on schedule.
Proactively fill gaps between functional groups and track commitments to genuine closure.

Requirements

Bachelor's or Master's degree in Electrical, Materials, Mechanical, or Semiconductor Engineering, or a related field
Nice to have: SoC architecture knowledge
Nice to have: SerDes
Nice to have: PHYs
Nice to have: memory controllers

Skills

semiconductor packaging technology integration

Packaging Engineer

Packaging Engineer

Responsibilities

Requirements

Skills

Benefits

Principal Semiconductor Packaging Technologist – Customer Solutions

Responsibilities

Requirements

Skills