- Shenzhen, China
- Senior
- 8+ years
Lead technical bridge between AMD internal teams and ODM/OEM partners, driving subsystem and firmware innovation for next‑generation laptop/PC products.
Responsibilities
- Serve as primary technical bridge between AMD internal teams and ODM/OEM partners
- Support subsystem solution definition and component selection (Audio, Display, Sensor, Storage, Memory)
- Collaborate with BIOS, System, HW, and ME teams on platform firmware – define ACPI/EC communication protocols, ensure Windows OS compatibility, resolve sleep/wake failures, power leakage, thermal abnormalities, and intermittent issues
- Identify and evaluate innovation solutions for next‑gen products – new interfaces, component technologies, firmware architectures – and present recommendations to AMD internal team
- Participate in technical design reviews on schematic, layout, BOM, firmware, and integration
Requirements
- Bachelor's degree in PC Computer Engineering or related field
- Nice to have: EC firmware development (AMI, Insyde, or equivalent)
- Nice to have: Experience with major ODM/OEM laptop companies
- Nice to have: Experience with AMD Ryzen‑based laptop platforms