- Boise, Idaho, United States
- On-site
- Full-time · Mid
The CMOS Device and Process Integration Lead (MTS) will provide technical leadership across advanced technology development, from defining electrical targets and test-chip strategies to silicon-to-model correlation and line monitoring.
Responsibilities
- Lead CMOS device and process-integration development, optimization, and characterization across advanced nodes, including FEOL, MOL, and BEOL interactions
- Define technology targets, electrical acceptance criteria, characterization strategies, and silicon-to-model correlation requirements across technology maturity levels
- Develop test structures, DOE and sampling strategies, and electrical monitors to quantify variability, detect process excursions, and improve process control
- Partner with modeling, manufacturing, DTCO, and circuit-design teams to connect silicon capability, compact/interconnect models, design assumptions, and technology specifications
- Apply statistical analysis, automation, and AI/ML methods to large electrical and process datasets to identify performance limiters, root causes, variability drivers, and opportunities for technology optimization
Requirements
- M.S. or Ph.D. in Electrical Engineering, Physics, Materials Science, or a related semiconductor field
- Nice to have: Defining technology targets
- Nice to have: Silicon characterization strategies
- Nice to have: Electrical control limits
- Nice to have: Line-monitoring methodologies