Advanced packaging processes jobs

Develop and maintain strong relationships with key accounts acting as the primary technical point of contact
Drive alignment between account teams and panel product line on priorities for market penetrations and defenses
Collaborate with customers to optimize advanced packaging/semiconductor manufacturing processes
Organize product demonstrations and presentations to showcase Lam Research technologies
Gather and relay customer feedback to internal teams

Principal/Senior Engineer, Process Engineering (Advanced Packaging)

ASM · Posted Nov 6, 2026

Lead advanced packaging process development, research, and optimization for next‑generation semiconductor devices.

Research, develop, and optimize semiconductor processes focused on Advanced Packaging including depositions (ALD, PECVD, PVD, ECP) and surface preparation.
Design and conduct complex experiments using DOE and RSM methodologies; interpret and analyze experimental data.
Develop new films or processes for emerging packaging applications like W2W/D2W Hybrid bonding and perform advanced materials characterization.
Provide mentorship to Process Engineers and lead technical problem‑solving sessions using scientific methods and tools such as Ishikawa diagrams.
Collaborate with customers and marketing teams to define requirements and execute demonstrations.

Master’s in Chemical Engineering, Materials Science, Electrical Engineering, or Physics
PhD in Chemical Engineering, Materials Science, Electrical Engineering, or Physics
Nice to have: integration advanced packaging process flows like CoWoS, SoIC, InFO
Nice to have: Process and equipment qualification data towards a full Semiconductor equipment PLC process
Nice to have: advanced metrology/Inspection characterization techniques