- Nijmegen, Gelderland, Netherlands
- On-site
- Full-time · Senior
- 3+ years
Develop and release products consisting of integrated circuits and plastic packages using CMOS or BCD technology and analog IC design tools.
Responsibilities
- Develop and release products, which are combinations of integrated circuits and plastic packages
- Act as technical lead of a cross-functional team of design engineering, product engineering, test engineering and product quality engineering
- Drive full-chip design, product specifications setting and verification while having ownership of top-level layout fit
- Design integrated circuits in 0.5um to 0.18um feature size CMOS and BCD wafer processes
- Develop products in a wide range of plastic packages with Cu-wire bond wiring
Requirements
- Master’s degree in electrical engineering