Responsible for executing advanced mechanical stress simulations for semiconductor advanced packaging, heterogeneous integration, and BEOL metallization layers, ensuring reliability and performance across device, die, chip, and package levels.
Locations (3)
Bloomington, Minnesota, United States
Florida, United States
Texas, United States
Compensation
The annual salary range for this role is $95,200 - $142,800. Pay offered is based on many factors, including, but not limited to, the job-related experience, skills, education, and credentials of each candidate.
Responsibilities
Develop and execute multi-level mechanical stress models for semiconductor devices, circuits, dies, chips, and packaging.
Simulate elastic, viscoelastic, and crack-related phenomena, including recoverable stress/strain, plastic deformation, delamination, and crack propagation, with direct impact on device performance and BEOL reliability.
Utilize advanced simulation software such as ANSYS, TCAD Sentaurus, SInterconnect, and MultiPhysics Fusion to analyze mechanical stress, heat transfer, and dissipation in semiconductor packaging and BEOL layers.
Plan test structures to characterize material properties (bulk modulus, shear modulus, coefficient of thermal expansion, binding strength) required for simulation and reproducing shortloop experiments.
Collaborate with process integration teams to utilize simulation results in design and manufacturing workflows.
Requirements
Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, or a related field
Nice to have: prior work in semiconductor industry, especially in packaging and BEOL
Nice to have: knowledge of device performance impacts due to mechanical stress
Nice to have: experience with characterization of material properties and shortloop experimental validation
Nice to have: semiconductor technology integration experience
