Lead a team responsible for Chemical Mechanical Planarization (CMP) and Bond, Trim, Grind (BTG) process development for advanced packaging applications, shaping technology roadmaps and driving process improvements.
- Lead, mentor, and develop a team of CMP and BTG engineers while fostering a culture of collaboration, accountability, safety, and continuous growth
- Drive CMP and BTG process development, characterization, integration, manufacturability, and process margin improvements for advanced packaging technologies
- Complete process development programs aligned with technology roadmaps, delivering robust and scalable solutions on schedule
- Partner with Process Integration, Manufacturing Development, Equipment Engineering, and global technology teams to solve integration challenges and enable technology breakthroughs
- Collaborate with equipment and materials suppliers to develop next-generation solutions, influence supplier roadmaps, and drive process improvements using data-driven and AI-enabled approaches
- Bachelor’s degree in Materials Science, Chemical Engineering, Physics, or a related engineering field
- Nice to have: Advanced degree in Materials Science
- Nice to have: Advanced degree in Chemical Engineering
- Nice to have: Advanced degree in Physics
- Nice to have: Advanced packaging development
Senior Manager – CMP/BTG, APTD ProcessNewMicron Technology · Boise, US