- Principal
- 6+ years
Responsibilities
- Developing and refining innovative package concepts for powering AI computing
- Validating the concepts using simulations and hardware demonstrators in collaboration with backend and product development teams and system architects
- Developing new ideas and assembly concepts in collaboration with backend development (in-house + OSAT) and initiating early-stage development projects to advance our packaging development
- Supporting development projects through to market launch
- Identifying and integrating technological trends into the overarching packaging roadmap
Requirements
- Electrical Engineering
- Physics
- Materials Science