- Taylor, Texas, United States
- On-site
- Full-time
- $106K–$145K per year
- 5+ years
A CMP (Chemical Mechanical Polishing) Process Engineer is responsible for the critical semiconductor manufacturing step of planarizing the wafer surface.
Compensation
The current base salary range for this role is between $106,000 - $145,000. Individual base pay rates will depend on factors including duties, work location, education, skills, qualifications and experience. Total compensation for this position will include a competitive benefits package and may include participation in company incentive compensation programs, which are based on factors to include organizational and individual performance.
Responsibilities
- Removal Rate (RR) Control
- Condition Optimization
- Recipe Management
- Defect & uniformity Management
- Consumable Life Cycle Management
Requirements
- BS or MS in Chemical, Mechanical, Electrical, or Industrial Engineering, Physics, Chemistry, Material Science, or Computer Science
- Nice to have: Familiar with Metrology Tools
- Nice to have: Experience with Ellipsometry, SEM, and AFM
- Nice to have: Experience on Defect Reduction
- Nice to have: Basic Idea of Fab Integration