- Singapore, Singapore
- Associate
- 2+ years
The RTP Engineer involves setting up and controlling tools/processes, sustaining performance, investigating excursions, and supporting product transfers in high-volume manufacturing environments.
A CMP (Chemical Mechanical Polishing) Process Engineer is responsible for the critical semiconductor manufacturing step of planarizing the wafer surface.
The current base salary range for this role is between $106,000 - $145,000. Individual base pay rates will depend on factors including duties, work location, education, skills, qualifications and experience. Total compensation for this position will include a competitive benefits package and may include participation in company incentive compensation programs, which are based on factors to include organizational and individual performance.