- Carmona, Cavite, Philippines
- 5+ years
Responsible for ensuring product quality, process stability, and continuous improvement across Front of Line semiconductor assembly operations.
Responsibilities
- Monitor and analyze quality performance metrics for Wafer Saw, Die Bond, and Wire Bond processes.
- Lead investigation of assembly-related defects, yield excursions, customer complaints, and manufacturing non-conformances using structured problem-solving methodologies.
- Implement and verify corrective and preventive actions to eliminate recurring quality issues.
- Drive continuous improvement projects focused on defect reduction, process capability improvement, yield enhancement, and cost of poor quality reduction.
- Review Statistical Process Control (SPC) data, process capability indices (Cp/Cpk), and quality trends to identify risks and opportunities for improvement.
Requirements
- Bachelor's Degree in Engineering (Electronics, Electrical, Mechanical, Industrial, Materials Science, or related discipline)
- Nice to have: supporting automotive semiconductor products
- Nice to have: IATF 16949 requirements
- Nice to have: Lean Manufacturing
- Nice to have: Six Sigma methodologies