- Hillsboro, Oregon, United States
- On-site
- Full-time · Senior
- 8+ years
Lead strategic technology engagement with advanced semiconductor packaging customers, translating market insights into product and business strategy.
Responsibilities
- Develop deep understanding of advanced semiconductor packaging trends
- Build trusted relationships with strategic semiconductor customers
- Translate customer insights into actionable recommendations
- Identify technology gaps and innovation priorities
- Collaborate across product management, field applications, sales, marketing, and executive leadership
Requirements
- Bachelor’s degree in Engineering, Materials Science, Physics, Electrical Engineering, or a related technical discipline. Advanced degree preferred.
- Nice to have: Semiconductor equipment manufacturing
- Nice to have: Semiconductor device manufacturers or foundries
- Nice to have: Advanced packaging organizations
- Nice to have: Failure analysis