- Shanghai, China
- Senior
- 8+ years
Lead product strategy, definition, and lifecycle management for multi-die package and system-in-package semiconductor products.
Responsibilities
- Monitor market dynamics and technology trends for integrated semiconductor products
- Analyze target applications, customer needs, competitor portfolios, supply‑chain conditions, cost structures, and packaging technology roadmaps
- Work closely with sales, field application, engineering, operations, and key customers to identify system‑level pain points and translate them into differentiated integration opportunities and product concepts
- Develop product roadmaps and portfolio plans for multi‑die package products; define product positioning, target markets, application scenarios, competitive value propositions, and business priorities
- Lead system‑level product definition across MCU, gate‑driver, power‑device, power‑management, and memory functions, balancing electrical performance, thermal performance, reliability, package size, cost, manufacturability, and supply continuity
Requirements
- Bachelor’s degree in Electronic Engineering, Microelectronics, Semiconductor Engineering, Materials Science, Automation, or a related discipline
- Master’s degree or MBA preferred