As a Yield Enhancement Engineer, you will drive strategic yield improvement initiatives across Micron's advanced memory portfolio, including DRAM, NAND, and HBM technologies. You will collaborate globally to optimize manufacturing performance, accelerate business outcomes, and advance engineering excellence through data-driven methodologies and AI-enabled solutions.
Responsibilities
Lead strategic yield improvement programs across DRAM, NAND, and HBM technologies by converting complex manufacturing and product challenges into scalable, actionable solutions.
Drive cross-fab yield benchmarking, performance analysis, and predictive modeling to identify improvement opportunities, establish performance targets, and accelerate yield optimization across global manufacturing sites.
Define, deploy, and sustain Yield Improvement (YE) Best Known Methods (BKMs) globally, enabling standardization, information exchange, and engineering excellence throughout Micron's manufacturing network.
Champion the digital transformation of Yield Management Systems (YMS) and Yield Enhancement workflows through automation, artificial intelligence, machine learning, and advanced analytics in partnership with Fab, SMAI, and multi-functional stakeholders.
Provide technical leadership and influence across Yield Enhancement (YE), Process Integration Engineering (PIE), Process Engineering (PE), Global Quality (GQ), Technology Development (TD), and Manufacturing teams to drive alignment and execution of strategic yield objectives.
Hardware Engineer Intern, Mechanical, supporting design, integration, testing, and continuous improvement of electrical hardware used in advanced semiconductor equipment.
Responsibilities
Support engineering projects related to the design, development, testing, and improvement of semiconductor equipment
Apply mechanical engineering principles, product requirements, and experimental data to support engineering design decisions
Assist with engineering calculations and analysis, including structural, thermal, and fluid dynamics
Create and update 3D CAD models, assemblies, and engineering drawings using Creo Parametric or similar tools
Participate in prototype builds, testing, data collection, and evaluation of mechanical designs
Requirements
Master’s in Mechanical Engineering or PhD in Mechanical Engineering or closely related engineering discipline
Nice to have: Experience with Creo Parametric and/or AutoCAD
Nice to have: Coursework, research, or project experience involving complex mechanical systems, thermal systems, fluid systems, vacuum systems, or precision equipment
Nice to have: Exposure to semiconductor deposition technologies such as Epitaxy, CVD, ALD, or PVD
Nice to have: Cleanroom, laboratory, research, prototype assembly, or hands-on testing experience
Module Engineer specializing in Wafer-Level Assembly, Die Preparation, and Metrology for high-volume manufacturing and technology development activities.
Compensation
Annual Salary Range for jobs which could be performed in the US: $76,390.00-146,440.00 USD
Responsibilities
Drive sustained operational excellence by proactively identifying and implementing safety and ergonomic improvements, excursion prevention measures, and initiatives that enhance equipment availability, utilization, and cost efficiency.
Collaborate with partner factories to transfer new processes, maintain Copy Exactly standards, share best practices, and drive continuous improvements in processes and equipment performance.
Develop and execute technology roadmaps to achieve process requirements, business objectives, and key milestones.
Install, qualify, and ramp equipment and manufacturing processes to support new product introductions and production start-up milestones.
Lead efforts to resolve complex technical challenges and implement robust systems that prevent recurrence.
Requirements
Bachelor's degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related technical field.
Nice to have: Master's degree
Nice to have: hands-on experience with semiconductor manufacturing equipment
Nice to have: working knowledge of DOE methodologies
Lead technology transfer, manufacturing readiness, quality improvement, and yield optimization activities for advanced packaging and technology development programs.
Compensation
Annual Salary Range for jobs which could be performed in the US: $89,010.00-146,440.00 USD
Responsibilities
Lead the integration of new technologies into manufacturing by defining roadmaps and operational strategies
Drive the integration of new technologies into manufacturing by ensuring product and process readiness from startup through high-volume manufacturing
Coordinate logistics of introducing new products into the factory by supplying required process documentation
Serve as primary information interface between the fab and upstream/downstream customers
Track collateral items and communicate wafer shipping to post fab customers
Requirements
Bachelor's degree in Chemistry, Mechanical Engineering, Materials Science, Electrical Engineering, or a related technical field, plus 2+ years of relevant experience
Master's degree in one of the fields listed above, plus 1+ year of relevant experience
Nice to have: Experience in more than one process module in a WLA, Die Prep, Sort, or Fab environment
Nice to have: Familiarity with manufacturing systems such as MES300
Nice to have: Knowledge of process improvement methodologies
Responsible for Wet Process Equipment sustainment, including system upgrades, tool installs and de-installs. Drive and manage vendor execution to meet goals. Provide hardware technical support to the Wet Process area.
Responsibilities
Responsible for Wet Process Equipment sustainment, including system upgrades, tool installs and de-installs
Drive and manage vendor execution to meet goals
Provide hardware technical support to the Wet Process area
Complete project milestones - close hardware gaps before transferring to manufacturing
Partner with process engineering to define hardware roadmaps, including wafer processing hardware, diagnostics, data collection requirements, and hardware quality control/variation reduction
Requirements
Bachelor's degree in Mechanical Engineering or related field
SR/STAFF ENGINEER, FECOS CPIE YENewMicron Technology · Boise, US
Intern, Mechanical EngineeringASM · Phoenix, US