- Boise, Idaho, United States
- 3+ years
Lead the development, optimization, and sustainment of RegE, bevel, and backside processes in a semiconductor fab.
Responsibilities
- Develop and optimize RegE, bevel, and backside process technologies to improve yield, quality, reliability, and cost performance
- Lead process improvement initiatives, utilizing data-driven methodologies to identify, diagnose, and resolve manufacturing challenges
- Monitor and improve process health metrics, defect control strategies, and process capability to strengthen manufacturing robustness
- Partner with cross-functional teams to investigate process abnormalities, implement corrective actions, and mitigate manufacturing risks
- Support technology development, qualification, and transfer activities by deploying best-known methods and capturing technical learning
Requirements
- Bachelor's degree in Engineering, Materials Science, Electrical Engineering, Chemical Engineering, or a related technical field
- Nice to have: Master's or PhD in Materials Science, Electrical Engineering, Electronics Engineering, Chemical Engineering, or a related field
- Nice to have: process integration
- Nice to have: technology development
- Nice to have: yield analysis