Lead a team responsible for Chemical Mechanical Planarization (CMP) and Bond, Trim, Grind (BTG) process development for advanced packaging applications, shaping technology roadmaps and driving process improvements.
Responsibilities
Lead, mentor, and develop a team of CMP and BTG engineers
Drive CMP and BTG process development, characterization, integration, manufacturability, and process margin improvements for advanced packaging technologies
Complete process development programs aligned with technology roadmaps, delivering robust and scalable solutions on schedule
Partner with Process Integration, Manufacturing Development, Equipment Engineering, and global technology teams to solve integration challenges and enable technology breakthroughs
Collaborate with equipment and materials suppliers to develop next-generation solutions, influence supplier roadmaps, and drive process improvements using data-driven and AI-enabled approaches
Requirements
Bachelor’s degree in Materials Science, Chemical Engineering, Physics, or a related engineering field
Nice to have: Advanced degree in Materials Science
Nice to have: Advanced degree in Chemical Engineering
Lead a team responsible for Chemical Mechanical Planarization (CMP) and Bond, Trim, Grind (BTG) process development for advanced packaging applications, shaping technology roadmaps and driving process improvements.
Responsibilities
Lead, mentor, and develop a team of CMP and BTG engineers while fostering a culture of collaboration, accountability, safety, and continuous growth
Drive CMP and BTG process development, characterization, integration, manufacturability, and process margin improvements for advanced packaging technologies
Complete process development programs aligned with technology roadmaps, delivering robust and scalable solutions on schedule
Partner with Process Integration, Manufacturing Development, Equipment Engineering, and global technology teams to solve integration challenges and enable technology breakthroughs
Collaborate with equipment and materials suppliers to develop next-generation solutions, influence supplier roadmaps, and drive process improvements using data-driven and AI-enabled approaches
Requirements
Bachelor’s degree in Materials Science, Chemical Engineering, Physics, or a related engineering field
Nice to have: Advanced degree in Materials Science
Nice to have: Advanced degree in Chemical Engineering
Nice to have: Advanced degree in Physics
Nice to have: Advanced packaging development
Skills
Sr Metrology Process Engineer, Technology Development
As a Metrology Engineer you will be collaborating with process and integration guides to qualify Low and High NA EUV lithography processes and other technology development projects that directly shape future memory technologies. You will work hands-on with equipment, materials, layouts, and data, while collaborating with global partners to move innovations from R&D into high-volume manufacturing. This role supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making.
Locations (3)
Albany, New York, United States
Boise, United States
Hiroshima
Compensation
$104,000.00 - $224,000.00 a year
Responsibilities
Develop and integrate metrology processes for advanced memory technologies
Perform material evaluations, reticle and layout development, OPC, overlay optimization, and process window analysis
Drive yield improvement, failure analysis, and device performance optimization
Sr Metrology Process Engineer, Technology Development
As a Metrology Engineer you will be collaborating with process and integration guides to qualify Low and High NA EUV lithography processes and other technology development projects that directly shape future memory technologies.
Compensation
The US base salary range that Micron Technology estimates it could pay for this full-time position is: $104,000.00 - $224,000.00 a year. Additional compensation may include benefits, bonuses and equity.
Responsibilities
Develop and integrate metrology processes for advanced memory technologies
Perform material evaluations, reticle and layout development, OPC, overlay optimization, and process window analysis
Drive yield improvement, failure analysis, and device performance optimization
Partner with equipment vendors to evaluate tools and improve process capability
Document processes, communicate results, and support technology transfer to manufacturing
Requirements
M.S. or Ph.D. in Electrical or Electronics Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, Computer Engineering, or other Engineering or Technical Degree relevant to Metrology
B.S. with 2+ years semiconductor processing experience with emphasis on metrology
Lead technical development of lithography processes for quantum technologies, bridging advanced technology development and semiconductor manufacturing.
Compensation
$118,000.00 - $210,000.00
Responsibilities
Serve as the QTS technical authority for advanced optical and related lithography processes
Develop and optimize lithography processes supporting quantum device and module development
Lead evaluation of resist systems, coat/develop processes, exposure strategies, alignment approaches, and patterning schemes
Drive improvements in critical dimension control, overlay, pattern fidelity, defectivity, and process window
Develop patterning strategies for unconventional quantum structures, materials, substrates, and integration requirements
The Lithography Advanced Manufacturing Engineering (AME) SMTS will serve as a senior technical leader responsible for developing and enabling lithography capabilities supporting next-generation quantum technologies.
Locations (2)
New York, New York, United States
Malta
Compensation
$118,000.00 - $210,000.00
Responsibilities
Serve as the QTS technical authority for advanced optical and related lithography processes
Develop and optimize lithography processes supporting quantum device and module development
Lead evaluation of resist systems, coat/develop processes, exposure strategies, alignment approaches, and patterning schemes
Drive improvements in critical dimension control, overlay, pattern fidelity, defectivity, and process window
Develop patterning strategies for unconventional quantum structures, materials, substrates, and integration requirements
Partner with equipment vendors to evaluate tools and improve process capability
Document processes, communicate results, and support technology transfer to manufacturing
Requirements
M.S. or Ph.D. in Electrical or Electronics Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, Computer Engineering, or other Engineering or Technical Degree relevant to Metrology
B.S. with 2+ years semiconductor processing experience with emphasis on metrology
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