- Livermore, California, United States
- Staff
- $163K–$214K per year
- 5+ years
Lead process integration for advanced memory and logic probe card architectures, driving manufacturability, yield, and reliability improvements.
Compensation
$163,400.00 - $214,410.00 Pay Range Explained: This role in Livermore, California pays between $163,400.00 and $214,410.00 per year, depending on your experience, skills, and background. Pay may vary in other locations.
Responsibilities
- Module Ownership and Process development: Assembly and Test Engineering activities ensuring Product technical excellence and alignment of electrical, mechanical and thermal and manufacturability requirements with product roadmap.
- Process Integration: Support development and qualification of new processes aligned with technology roadmaps and product launches; partner with operations to transition processes from development to high-volume manufacturing.
- Yield, Cycle Time and Efficiency Optimization: Implement strategies to improve yield, cycle time and process efficiency using SPC, DOE, and root cause analysis.
- Equipment Engineering Development strategy: Collaborate with module owners to help them define new equipment structure and roadmaps that support cycle time, capacity and process improvement plans.
- Data-Driven Improvements: Utilize analytics and process control tools to monitor performance, identify trends, and implement corrective actions. Communicate performance metrics and drive continuous improvement initiatives.