- San Diego, California, United States
- Full-time · Staff
- $170K–$255K per year
- 6–10 years
Designs and develops motherboards/add in cards/modules for Qualcomm new AI System On Chip (SoC)/System In Package (SIP) within the Data Center AI Hardware Engineering team.
Compensation
$169,800.00 - $254,600.00
Responsibilities
- Lead schematics design, PCB layouts, design reviews, component selections, mechanical and thermal designs, and develop test plans.
- Co-develop functional specifications for systems, cards, sub-systems, and rack-level architectures.
- Collaborate with internal teams and ODMs to develop and support customer-specific hardware and system requirements.
- Facilitate consensus on technical trade-offs at hardware, software, and chip design levels.
- Support architecture and card designs including accelerator SoCs, memory, I/O, power delivery, electrical/mechanical integration, and PCB definition/design.
Requirements
- Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field
- Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field
- PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field
- Nice to have: circuit design (digital, analog, RF)