- San Jose, California, United States
- $155K–$225K per year
- 4+ years
Advanced packaging technology development engineer focused on silicon photonic packaging and electronic-photonic integration.
Compensation
The starting salary range posted for this position is $154,900.00 to $225,300.00 and reflects the projected salary range for new hires in this position in U.S. and/or Canada locations, not including incentive compensation*, equity, or benefits.
Responsibilities
- Drive definition, design and analysis of packaging technology test vehicles
- Drive validation of new technology against key performance metrics
- Apply deep process expertise to oversee wafer processing, fine pitch bumping, D2W/W2W hybrid bonding, fanout, advanced substrate development, and assembly
- Work with top-tier foundry and assembly partners to develop and qualify robust packaging solutions for high density photonics integration, CPO and on-board optics
- Utilize design and modeling experience to guide Design for Manufacturability (DfM) and Design for Reliability (DfR)
Requirements
- PhD or MS in Mechanical Engineering, Electrical Engineering, Physics, or a related field
- Nice to have: physical failure analysis
- Nice to have: hybrid bonding
- Nice to have: thin die/wafer processing
- Nice to have: finite element analysis