Developing and refining innovative package concepts for powering AI computing
Validating the concepts using simulations and hardware demonstrators in collaboration with backend and product development teams and system architects
Developing new ideas and assembly concepts in collaboration with backend development (in-house + OSAT) and initiating early-stage development projects to advance our packaging development
Supporting development projects through to market launch
Identifying and integrating technological trends into the overarching packaging roadmap
Define package concepts for AI power supply products with focus on high-performance computing modules
Locations (3)
Andover, Massachusetts, United States
El Segundo, California, United States
San Jose, California, United States
Compensation
The Wage range that the company expects to pay for a qualified candidate in the United States is: Andover, MA Minimum of $156,900 salary per year / Maximum of $215,700 salary per year
El Segundo, CA Minimum $155,900 salary per year / Maximum of $214,400 salary per year
San Jose, CA Minimum $184,500 salary per year / Maximum of $253,700 salary per year
Responsibilities
Define package concepts for AI power supply products with focus on high-performance computing modules
Validate package concepts through simulation and hardware demonstrators in cooperation with Back End development, product development and system architects
