- Goleta, California, United States
- On-site
- Full-time · Mid
- $159K–$230K per year
- 3+ years
Lead the development, integration, and Release to Production of temporary wafer bonding, thinning, and debonding (TB/DB) processes for Google Quantum AI’s next-generation quantum processors.
Compensation
US: $159000 - $230000 (USD) + 15% bonus target + equity + benefits
Responsibilities
- Develop, integrate, and transition to production temporary adhesive bonding and laser debond processes and equipment for advanced 3D Integration of quantum devices.
- Specify, bring up, and qualify required clean room equipment and advanced metrology capabilities, establishing baseline operational recipes and documentation.
- Drive process integration activities around wafer thinning, thin-wafer handling, and stress/warp mitigation.
- Coordinate vendor evaluations, off-site demos, technology transfers, and Release to Production of tools and processes into quantum device production processes.
- Troubleshoot processing anomalies, improve yield, and train cleanroom personnel and technicians on standard operating procedures.
Requirements
- Bachelor’s degree in Electrical Engineering
- Computer Engineering
- Computer Science
- Physics
- specialized field (e.g., Optics, Sensors, Audio/DSP, etc.)