- Hsinchu, Taiwan, Taiwan
Technology leader responsible for driving Co-Packaged Optics (CPO) and Silicon Photonics technology development from concept to high-volume manufacturing.
Responsibilities
- Work with product architects and Silicon Photonics technology teams to define optical engine architectures, package architectures, and long-term technology roadmaps.
- Drive Silicon Photonics technology development from wafer process integration through packaging, qualification, and production deployment.
- Partner with foundries to develop and optimize Silicon Photonics manufacturing processes, yield strategies, and technology qualification plans.
- Design multi-fiber optical connectors and work with ecosystem partners to establish scalable optical connectivity solutions.
- Enable new package technology development initiatives including 2.5D, 3D, hybrid bonding, and optical packaging technologies from concept to full qualification.
Requirements
- BS/MS/PhD in Material Science
- BS/MS/PhD in Mechanical Engineering
- BS/MS/PhD in Computer Science
- BS/MS/PhD in Applied Mathematics
- BS/MS/PhD in Electrical Engineering