Lead the design, development, and analysis of complex, high‑speed electronic circuits for advanced medical imaging and camera systems.
Responsibilities
Lead the design and development of complex, high‑speed analog, digital, and mixed‑signal electronic circuits incorporating SoCs, FPGAs, video transceivers, image sensors, power architectures, and high‑speed data interfaces.
Perform advanced system modeling, circuit analysis, and simulation of imaging system components, including amplifiers, A/D converters, timing generation, cables, and digital signal processing systems.
Evaluate worst‑case component tolerances, signal integrity, thermal performance, and system reliability to ensure optimal product performance and consistent manufacturing yields.
Research and develop innovative circuit designs, electronic components, high‑density packaging technologies, and advanced analytical techniques for future medical imaging products.
Collaborate with Electrical, Mechanical, Thermal, PWB Design, Manufacturing, and Quality Engineering teams to optimize circuit layouts, product performance, manufacturability, and long‑term reliability.
Requirements
Bachelor's degree in Electrical Engineering, preferably with an emphasis in mixed‑signal design, or a related field with 9+ years of experience in analog/digital system design and analysis; or a Master's degree in Engineering or a related field with 7+ years of relevant experience preferred.
Nice to have: designing electronic systems incorporating FPGAs, SoCs, and advanced image sensors
Nice to have: knowledge of color and monochrome imaging technologies
Nice to have: single‑chip and three‑chip camera systems
Nice to have: interlaced and progressive scan architectures
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