Conduct research in advanced power electronics packaging and power semiconductor modules, supporting externally funded projects and collaborating with faculty, students, industry partners, and research organizations.
Commensurate with education and experience.
- Conduct research in advanced power electronics packaging and power semiconductor modules
- Develop and evaluate advanced power module packaging concepts and technologies through modelling, simulation, fabrication, and experimental characterization
- Investigate electrical, thermal, mechanical, reliability, and manufacturability aspects of advanced power module packaging
- Contribute to externally funded research projects and collaborate with faculty, students, industry partners, and other research organizations
- Ph.D. in Electrical Engineering or a closely related field
- Nice to have: power module packaging materials
- Nice to have: fabrication processes
- Nice to have: baseplates
- Nice to have: substrates