- California, United States
- On-site
- 10+ years
Lead definition, development, and qualification of advanced 2.5D and 3D packaging technologies for future Apple products.
Responsibilities
- Define and develop cutting‑edge 2.5D/3D packaging architectures
- Qualify and transition technologies to high‑volume manufacturing
- Collaborate cross‑functionally with silicon design, physical design, SI/PI, thermal, and manufacturing teams
- Guide technologies from early architecture exploration through qualification
Requirements
- Bachelor's degree
- Nice to have: PhD
- Nice to have: 6+ years of experience
- Nice to have: strong technical background in 2.5D/3D packaging
- Nice to have: broad systems mindset