Finite-element analysis jobs

Senior Director, Package Design & Engineering

NAVITAS SEMICONDUCTOR USA, INC. · Posted Nov 4, 2026

Raleigh, North Carolina, United States
Full-time · Director

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Lead package architecture, design, development and qualification across Navitas' GaN and SiC portfolio. Define the package technology roadmap and guide global engineering execution for advanced discrete and power IC packages from concept through high-volume manufacturing.

Responsibilities

Own and execute the global package design and engineering roadmap for GaN and SiC products, aligned with product, technology and business priorities.
Build, lead, and develop a global organization spanning package architecture, design, materials, process development, simulation, qualification, and manufacturing readiness.
Lead package platform development from concept selection and feasibility through design freeze, qualification, safe launch, volume ramp, and post-release improvement.
Establish clear technical requirements, design rules, development methods, decision gates, and release criteria for package and IC programs.
Create a disciplined engineering culture centered on technical excellence, accountability, rapid learning cycles, data-driven decisions, and on-time closure of risks and actions.

Skills

power semiconductor packaging gallium nitride (GaN)silicon carbide (SiC)assembly processes

Mechanical Engineer – Diagnostics

Mechanical Engineer – Diagnostics

Responsibilities

Requirements

Skills

Benefits

Senior Director, Package Design & Engineering

Responsibilities

Skills