- Samut Prakan, Samut Prakan, Thailand
- On-site
- Full-time · Staff
- 7+ years
Drive technology integration for semiconductor packaging, focusing on process interaction, risk assessment and new chip technology integration.
Responsibilities
- Drive Technology Integration activities to ensure the package fulfills requirements in terms of process interaction.
- Perform PBC and TPC assessments and drive Package Technology DFMEA.
- Own Risk Interaction assessment and mitigation work packages.
- Drive pre-development for new chip technology.
- Integrate unit processes (BOM and Process) and new chip technology into the package platform, including risk assessment, process interaction studies, and process flow.
Requirements
- Bachelor’s Degree in Engineering
- Semiconductor Technology
- Microelectronics
- Automation
- Mechanical