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MEMS Wafer Fab G5 KKM Process Engineer

HP · Posted Nov 4, 2026

Singapore, South West, Singapore
On-site
Full-time · Senior
5–10 years

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Technical owner and subject matter expert for G5 KKM workcenter, specializing in Grinder, Stealth Dicer, and Separator process technologies to support future printhead products.

Responsibilities

Serve as the technical owner for Grinder, Stealth Dicer, and Separator technologies.
Define process capability roadmap, technology strategy, equipment roadmap, and manufacturing standards.
Develop long-term plans to improve process capability, productivity, yield, and manufacturing robustness.
Lead development and qualification of next-generation wafer thinning and singulation processes.
Drive advanced process characterization through DOE, process modeling, statistical analysis, and reliability evaluations.

Requirements

Bachelor or Master degree in Mechanical Engineering
Manufacturing Engineering
Materials Science
Electrical Engineering
Physics

Skills

semiconductor wafer fabrication MEMS manufacturing advanced manufacturing wafer backgrinding thinning

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