New Mexico Wafer Packaging Manufacturing Advanced Packaging Die Pick Engineering Group Leader
Intel Corporation · Posted Nov 6, 2026
- Albuquerque, New Mexico, United States
- On-site
- Full-time
- $121K–$232K per year
- 6+ years
Lead a team of engineers to support high-volume manufacturing processes and drive advancements within Intel's next-generation packaging technologies.
Compensation
Annual Salary Range for jobs which could be performed in the US: $120,860.00-231,670.00 USD
Responsibilities
- Lead and manage a team of engineers to support safe, high-volume manufacturing processes while driving continuous improvements in quality, output, cost, and yield.
- Provide tactical direction and prioritize activities for sustaining operations, systematic troubleshooting, and process optimization.
- Collaborate with cross-functional engineering and manufacturing teams to address integrated process and equipment challenges.
- Develop and mentor engineers, cultivating technical expertise, leadership skills, and long-term growth opportunities within the team.
- Facilitate technology transfer and ensure matched processing across global sites through training sessions and audits.
Requirements
- Bachelor's degree in engineering, materials science, physics, or a related technical field
- Nice to have: Master's degree
- Nice to have: PhD
- Nice to have: vendor collaboration
- Nice to have: strategic planning