- Boise, Idaho, United States
- Senior
- 10+ years
Lead dry etch process development and shape technology roadmaps for DRAM nodes.
Responsibilities
- Lead development and optimization of dry etch processes
- Partner with process integration and engineering teams
- Lead cross‑functional teams and technical task forces
- Develop and present process and technology roadmaps
- Serve as a technical resource and mentor
Requirements
- MS
- PhD
- Nice to have: advanced CMOS
- Nice to have: DRAM technologies
- Nice to have: statistical process control