Senior/Principal NAND Module Process Integration Engineer in the Singapore R&D department at Micron Technology Inc.
Responsibilities
Identify and quantify key module deficiencies and technology gaps
Lead cross-functional teams to address these issues
Improve current process flows and develop innovative solutions to meet product requirements and manufacturability
Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability
Coordinate activities at the manufacturing site to secure funding for experiments, and conversions, and effectively communicate decisions to relevant R&D, Product Engineering, and Manufacturing partners
Requirements
BS, MS/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science or a related field
Senior/Principal NAND Module Process Integration Engineer in the Singapore R&D department at Micron Technology Inc., responsible for designing, developing, integrating, and implementing innovative process solutions to improve next-generation 3D NAND product yield and quality.
Responsibilities
Identify and quantify key module deficiencies and technology gaps
Lead cross-functional teams to address these issues
Improve current process flows and develop innovative solutions to meet product requirements and manufacturability
Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability
Coordinate activities at the manufacturing site to secure funding for experiments, and conversions, and effectively communicate decisions to relevant R&D, Product Engineering, and Manufacturing partners
Requirements
BS, MS/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science or a related field
Nice to have: Exposure to R&D (such as HKMG) and transfer/manufacturing
Member of Technical Staff in NAND Module Process Integration Team responsible for designing, developing, integrating, and implementing process solutions to improve 3D NAND product yield and quality.
Locations (2)
Singapore
Vimercate, Lombardy, Italy
Compensation
The base salary range that Micron estimates it could pay in for this position full-time is: €75,000.00 - €132,000.00 per year, with A1 CCNL Level.
Responsibilities
Lead process modules related to 3D NAND semiconductor IC development
Define structural specifications and process requirements
Set direction and vision for modules
Proactively resolve potential structure, electrical and reliability issues
Optimize performance and manufacturability
Requirements
PhD in Electrical Engineering, Microelectronics, Materials Science, Chemical Engineering, Physics or related field
Master’s in Electrical Engineering, Microelectronics, Materials Science, Chemical Engineering, Physics or related field
