- Austin, Texas, United States
Lead advanced semiconductor package integration for AMD EPYC server products, driving global teams, NPI, and process qualification.
Responsibilities
- Define test-vehicle and product-package designs and create execution plans with cross-functional teams.
- Lead technology development and product NPI, coordinating milestones across geographies and suppliers.
- Identify technical and schedule risks; develop and implement mitigation plans.
- Troubleshoot and resolve issues affecting schedule, yield, reliability, and process robustness.
- Collect, analyze, and present data to drive technical decisions and continuous improvement.
Requirements
- BS/MS/PhD in Mechanical Engineering
- BS/MS/PhD in Material Science
- BS/MS/PhD in Electrical Engineering
- BS/MS/PhD in Chemical Engineering
- equivalent