- Goleta, California, United States
- Senior
- 9+ years
Lead the design, development, and analysis of complex, high‑speed electronic circuits for advanced medical imaging and camera systems.
Responsibilities
- Lead the design and development of complex, high‑speed analog, digital, and mixed‑signal electronic circuits incorporating SoCs, FPGAs, video transceivers, image sensors, power architectures, and high‑speed data interfaces.
- Perform advanced system modeling, circuit analysis, and simulation of imaging system components, including amplifiers, A/D converters, timing generation, cables, and digital signal processing systems.
- Evaluate worst‑case component tolerances, signal integrity, thermal performance, and system reliability to ensure optimal product performance and consistent manufacturing yields.
- Research and develop innovative circuit designs, electronic components, high‑density packaging technologies, and advanced analytical techniques for future medical imaging products.
- Collaborate with Electrical, Mechanical, Thermal, PWB Design, Manufacturing, and Quality Engineering teams to optimize circuit layouts, product performance, manufacturability, and long‑term reliability.
Requirements
- Bachelor's degree in Electrical Engineering, preferably with an emphasis in mixed‑signal design, or a related field with 9+ years of experience in analog/digital system design and analysis; or a Master's degree in Engineering or a related field with 7+ years of relevant experience preferred.