- Boise, Idaho, United States
- 8+ years
Provide technical leadership for memory process integration, leading device-module and process-integration development, and influencing technical decisions throughout the development and manufacturing lifecycle.
Responsibilities
- Define and optimize advanced semiconductor process flows, including integration requirements and performance specifications.
- Lead the resolution of complex integration issues across process, materials, device, and product engineering teams.
- Drive device performance and reliability improvements, including electrical uniformity, leakage, time-dependent dielectric breakdown, and long-term reliability.
- Build and complete structured design-of-experiments studies to accelerate technical learning, reduce defects, and improve performance.
- Lead data-driven yield-improvement activities and support technology transfer across engineering and manufacturing teams.
Requirements
- Master’s degree or equivalent experience, or PhD, in Electrical Engineering, Microelectronics, Materials Science, Chemical Engineering, or a related field.
- Nice to have: advanced semiconductor module interactions
- Nice to have: system-level integration behavior
- Nice to have: advanced semiconductor materials
- Nice to have: long-term technology development