Lead the development, integration, and qualification of advanced semiconductor package technologies, focusing on risk assessments, package integration, and cross-functional collaboration.
- Drive Package Business Case (PBC) and Technology Project Case (TPC) assessments, ensuring technical feasibility, manufacturability, and technology readiness for new package developments.
- Lead Package Technology Design Failure Mode and Effects Analysis (DFMEA) activities and drive proactive risk identification, assessment, and mitigation strategies throughout the development lifecycle.
- Own risk interaction assessments and mitigation work packages related to package technologies, materials, process integration, and manufacturing readiness.
- Drive the integration of unit processes, Bills of Materials (BOM), and process flows within package platforms, including assessment of inter-process interactions and technology compatibility.
- Act as the key technical partner for Front-End (FE) and Back-End (BE) interaction topics, ensuring successful technology integration across development and manufacturing environments.
- Semiconductor Technology
- Microelectronics
- Automation Engineering
- Mechanical Engineering
- Electrical Engineering
