- Bangalore, India
- On-site
- Full-time · Senior
- 6+ years
Play a pivotal role in advancing Intel's silicon packaging capabilities, ensuring reliability, quality, and innovation in every solution.
Responsibilities
- Develop and define package architecture specifications based on product requirements, ensuring alignment with physical, electrical, thermal, and reliability standards.
- Lead technology tradeoff evaluations to deliver optimal solutions that balance performance, manufacturability, and cost.
- Collaborate with silicon, hardware, and packaging teams to ensure high-quality package designs and seamless integration into production workflows.
- Oversee the end-to-end package development process, including design, processes, and procedures, while continuously improving packaging quality standards.
- Troubleshoot packaging design challenges, identify root causes, and implement innovative and cost-effective solutions.
Requirements
- Bachelor's degree in a relevant field (e.g., Electrical Engineering, Mechanical Engineering, Materials Science)
- Master's degree in a relevant field
- PhD in a relevant field
- Nice to have: collaboration with cross-functional teams
- Nice to have: communication skills