- Santa Rosa, California, United States
- On-site
- Full-time · Entry
- $77K–$191K per year
- 0+ years
Lead development of next-generation System in Package (SiP) modules and drive process research, development, and integration for advanced semiconductor packaging.
Compensation
Santa Rosa, CA Pay Range: MIN $76,870.00 - MAX $191,030
Responsibilities
- Lead development of next-generation SiP modules
- Drive process control and stability through SPC
- Work closely with process, integration, product, and SiP design engineers
- Define process and performance targets
- Define process flows and drive continuous process improvement
Requirements
- M.S. or Ph.D. in Materials Science, Physics, Chemistry, Mechanical Engineering, Manufacturing Engineering, Mechatronics
- B.S. graduates with relevant experimental research experience
- Nice to have: industrial semiconductor
- Nice to have: advanced packaging
- Nice to have: heterogeneous integration