NM Wafer Packaging Manufacturing: Advanced Packaging Module Engineer
Intel Corporation · Posted Nov 5, 2026
- Albuquerque, New Mexico, United States
- On-site
- Full-time
- $76K–$146K per year
1–2 jobs· newest first
$76K–$146KOn-site · Full-time
$89K–$146KHybrid · Full-time
+10K new in the last hour
Intel Corporation · Posted Nov 5, 2026
Module Engineer specializing in Wafer-Level Assembly, Die Preparation, and Metrology for high-volume manufacturing and technology development activities.
Annual Salary Range for jobs which could be performed in the US: $76,390.00-146,440.00 USD
Lead technology transfer, manufacturing readiness, quality improvement, and yield optimization activities for advanced packaging and technology development programs.
Annual Salary Range for jobs which could be performed in the US: $89,010.00-146,440.00 USD