As a Module Development Engineer, you will drive technology development and process enablement for both high-volume manufacturing and next-generation semiconductor technologies.
Compensation
Annual Salary Range for jobs which could be performed in the US: $115,110.00-162,500.00 USD
Responsibilities
Lead the development and optimization of advanced semiconductor manufacturing processes
Design and conduct experiments, feasibility studies, simulations, and characterization activities
Drive technology development and process integration solutions
Define, develop, and validate integrated Module Target Specifications
Develop and maintain integrated Failure Mode and Effects Analyses
Requirements
Bachelor's degree in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related STEM discipline
Master's degree in a related STEM discipline
PhD in a related STEM discipline
Nice to have: troubleshoot manufacturing processes and equipment
Design and optimize manufacturing processes for display and semiconductor technologies, leading technical programs and collaborating with cross‑functional teams.
Locations (2)
Albany, New York, United States
Santa Clara, California, United States
Compensation
$128,000.00 - $176,000.00
Responsibilities
Owns, manage, and drive technical programs, report out timely status and interface with various stakeholders and management leading to completion.
Develop, optimize, and own process flows, ensuring the highest level of product performance, yield, and reliability.
Collaborate with design, process, and equipment engineers to define and implement process integration strategies and methodologies.
Process and manage wafers and integration lots through process flows in integration lines and collect metrology data to ensure meeting SPC spec.
Collect on‑wafer data, perform data analysis, and provide outcome, learnings and plan for the next process steps.
Support the development of next-generation semiconductor packaging technologies, focusing on 3D IC and advanced manufacturing processes.
Compensation
Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD
Responsibilities
Develop, evaluate, and optimize semiconductor manufacturing processes supporting next-generation 3D IC and advanced packaging technologies.
Support technology development initiatives focused on introducing new processes and manufacturing capabilities for future technology generations.
Conduct process characterization, experimental evaluations, and data analysis to identify opportunities for process improvement.
Apply statistical process control (SPC), design of experiments (DOE), and engineering analysis techniques to evaluate process performance and support technology development.
Troubleshoot manufacturing process and equipment challenges, perform root cause analysis, and implement corrective actions to improve process performance.
Requirements
Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related STEM field with 4+ years of experience in semiconductor manufacturing, process development, or equipment development.
Master's degree in the same fields with 3+ years of experience in semiconductor manufacturing, process development, or equipment development.
2027 Spring Process Engineer Co-op - Doctorate (Gloucester, MA)
Work hands‑on with advanced semiconductor equipment and processes while following established laboratory safety procedures, including limited chemical handling as required.
Support laboratory and process development activities, including equipment preparation, wafer processing, wafer measurements and metrology, data collection and analysis, and documentation of experimental results.
Lead small‑scale development projects, analyze results, and present findings to engineering teams.
Support laboratory and process engineering activities as needed.
Requirements
Doctoral degree (or Master's) in Materials Science & Engineering, Chemical Engineering, Chemistry, Physics, Electrical Engineering, or a related technical field
Develop, optimize, and validate electronics manufacturing and semiconductor manufacturing processes using PulseForge technologies, executing experimental plans and contributing to process innovation.
Compensation
$115,000- $120,000 annual, commensurate on experience.
Responsibilities
Develop and implement internal process development projects
Design and execute experiments (DOE) to optimize processing conditions
Maintain ownership of technical development projects
Collaborate with mechanical, electrical, and software engineering teams
Support prototype tool validation and process qualification
Requirements
Bachelor’s degree in Engineering, Physics, Materials Science, Chemistry, or a related field
Nice to have: Master’s degree or higher in engineering, material sciences or physical sciences
Nice to have: cleanroom experience
Nice to have: semiconductor device manufacturing processes
Support the 300mm semiconductor technology development integration team by contributing to the process integration of silicon photonic devices across development, customer engagement, qualification, and production readiness.
Locations (2)
New York, New York, United States
Malta
Compensation
$20.00 - $40.00
Responsibilities
Collaborate with device, process module, packaging, test, and integration teams to develop and drive silicon photonics input/output solutions.
Learn integration module ownership while supporting the development and qualification of silicon photonics input/output processes and structures.
Assist with analysis of process, device, and yield data to identify trends, document results, and support technical problem solving.
Support project execution through experiment tracking, status communication, and preparation of technical summaries for cross-functional stakeholders.
Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
New Mexico Wafer Packaging Manufacturing Advanced Packaging Die Pick Engineering Group Leader
Lead a team of engineers to support high-volume manufacturing processes and drive advancements within Intel's next-generation packaging technologies.
Compensation
Annual Salary Range for jobs which could be performed in the US: $120,860.00-231,670.00 USD
Responsibilities
Lead and manage a team of engineers to support safe, high-volume manufacturing processes while driving continuous improvements in quality, output, cost, and yield.
Provide tactical direction and prioritize activities for sustaining operations, systematic troubleshooting, and process optimization.
Collaborate with cross-functional engineering and manufacturing teams to address integrated process and equipment challenges.
Develop and mentor engineers, cultivating technical expertise, leadership skills, and long-term growth opportunities within the team.
Facilitate technology transfer and ensure matched processing across global sites through training sessions and audits.
Requirements
Bachelor's degree in engineering, materials science, physics, or a related technical field
