Referso Jobs

Advanced Packaging Development Engineer

Apple · Posted Nov 11, 2026

Open

California, United States
On-site
Full-time · Senior

Apply with Referso

Advanced Packaging Development Engineer

Apple · Posted Nov 11, 2026

Open

California, United States
On-site
Full-time · Senior

Apply with Referso

Advanced Packaging Development Engineer

Apple · Posted Nov 11, 2026

Open

Santa Clara, California, United States
On-site

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Lead definition, development, and qualification of advanced 2.5D and 3D packaging technologies for future Apple products.

Responsibilities

Define and develop cutting‑edge 2.5D/3D packaging architectures
Qualify and scale packaging technologies for high‑volume manufacturing
Collaborate with silicon design, physical design, SI/PI, thermal, and manufacturing teams
Guide technologies from early architecture exploration through qualification

Requirements

Bachelor’s degree required
Degree: B.S., M.S., or Ph.D. in Physics, Materials Science, Electrical Engineering, Mechanical Engineering, Computer Engineering, or a related technical discipline

Skills

2.5D/3D packaging hybrid bonding interposers fine‑pitch microbumps Through‑Silicon Vias (TSVs)fab BEoL/MEoL interconnect processing

Advanced Packaging Metallization Segment Leader

Qnity · Posted Sep 12, 2026

Open

Taoyuan City, Taoyuan City, Taiwan
Full-time · Lead
10+ years

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Develop and drive strategic business plans to achieve revenue growth, market share expansion, and profitability objectives within the advanced packaging metallization segment.

Responsibilities

Develop and drive strategic business plans to achieve revenue growth, market share expansion, and profitability objectives
Conduct ongoing market analysis to track industry dynamics and align insights with business strategy
Identify, prioritize, and drive key growth initiatives
Lead and coordinate cross-functional efforts across sales, product management, and other internal teams
Track key market indicators and analyze their impact on the Advanced Packaging business

Requirements

Bachelor’s degree in Chemistry
Bachelor’s degree in Chemical Engineering
related analytical field
Nice to have: Advanced degree (MS, PhD, or MBA)
Nice to have: Experience in technology (R&D or Applications)

Skills

Advanced packaging WLP (Wafer Level Packaging)2.5D/3D packaging FO (Fan-out)

2.5D/3D packaging jobs

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