Lead integration of advanced packaging technologies in Singapore, driving architecture, qualification, and manufacturing readiness.
Responsibilities
Serve as lead integrator for 3DHi and 2.5D technology development programs
Define and integrate end-to-end process flows for chiplet-based 2.5D and 3DHi solutions
Own integration trade‑off analysis across performance, reliability, yield, and manufacturability
Define test‑site requirements and lead development of test structures and vehicles
Establish process‑control, inspection, metrology, defectivity, and qualification strategies
Requirements
Bachelor’s degree or higher in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, Physics, or a related technical field
Nice to have: Advanced degree in a relevant engineering or science discipline
Nice to have: Experience in Singapore’s semiconductor ecosystem
Nice to have: Established working relationships with Singapore‑based research institutes, universities, OSATs, equipment suppliers, materials vendors, or other advanced packaging partners
Nice to have: Working knowledge of 2.5D/3D design enablement and co‑design considerations
An experienced ASIC Package Engineer focused on advanced packaging development, process integration, and designing custom silicons for infrastructure/AI/ML and networking applications.
Locations (2)
Hsinchu, Taiwan, Taiwan
Taipei, Taiwan, Taiwan
Responsibilities
Perform package design for AI/ML and networking applications custom Si with single-chip/multi-chip and SiP/module packaging
Design feasibility studies and analyses to ensure good manufacturing at ODM
Lead development of disruptive advanced packaging technologies from concept to product, including test vehicle definition and building with ecosystem partners
Work with internal Si, architecture and system teams, and externally with engaged partners, ODM, design houses and OSAT companies
Perform design analysis and what-if scenarios for novel packaging schemes such as 2.5D/3D and heterogeneous integration
Requirements
Bachelors degree in Materials Science
Mechanical Engineering
Electrical Engineering
related field
Master's degree or PhD in Materials Science, Mechanical Engineering, or a related discipline
