- Remote, United States
- Remote
- Full-time · Senior
- $180K–$260K per year
- 5+ years
1–2 jobs· newest first
$180K–$260KRemote · Full-time · Senior
$200K–$280KRemote · Full-time · Principal
+10K new in the last hour
Implement advanced ASIC package architecture, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions, supporting the end-to-end package strategy for high-performance mixed-signal and digital SoCs.
Base salary range for this role is $180,000 – $260,000 + equity in the company
Lead advanced ASIC package architecture and execution, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions, owning the end-to-end package strategy for high-performance mixed-signal and digital SoCs.
Base salary range for this role is $200,000 – $280,000 + equity in the company