- California, United States
- On-site
- 10+ years
Responsibilities
- Work with cross-functional teams and lead package integration and architecture efforts.
- Work with 3rd party and OSAT to bring packaging solution from concept to HVM Drive industry with advanced package solutions and specs.
- Work to bring innovative packaging solutions from concept to mass production, including package, module, and technology development.
- People managerial skills highly desirable.
- Travel – 5-10%
Requirements
- BS
- Nice to have: Managerial skills highly desired
- Nice to have: Background knowledge of Cellular/Connectivity/PMU packaging