- Bengaluru, Karnataka, India
- On-site
- Full-time · Senior
- 5+ years
Seeking an SI/PI Engineer with deep hands-on expertise in full-wave electromagnetic modeling and circuit-level channel simulation for advanced semiconductor packages. The role involves building package, connector, and socket models for 224G PAM4 optical interconnect modules.
Responsibilities
- Build 3D full-wave models of package interconnect, vias, breakouts, bump and ball transitions, and connector/socket interfaces in Ansys HFSS (or equivalent)
- Extract S-parameter and RLC models of package channels and PDNs using HFSS, SIwave, or Cadence Clarity/PowerSI
- Simulate channels in Keysight ADS: cascaded S-parameter analysis, TDR/TDT, frequency- and time-domain response, and transient or statistical eye analysis
- Evaluate insertion loss, return loss, NEXT/FEXT, mode conversion, and impedance profiles against package, connector, and channel budgets up to and beyond 224G-class Nyquist frequencies
- Set pre-layout routing rules, stack-up recommendations, and via/launch designs, and iterate with package layout designers to close margin
Requirements
- Bachelor's in Electrical Engineering or related field
- Master's or Ph.D. with a focus on electromagnetics, or high-speed design (preferred)
- Nice to have: EECQ/COM experience
- Nice to have: IEEE 802.3dj awareness
- Nice to have: OIF CEI-112G/224G channel requirements awareness