Own end-to-end quality and reliability strategy for Google’s hardware across its lifecycle, leading cross-functional teams and driving continuous improvement.
Define and own the end-to-end quality and reliability strategy for Google’s hardware across its entire lifecycle, from design through field support.
Lead the resolution of complex, systemic quality issues in manufacturing and the field, driving Root Cause and Corrective Actions (RCCA) using structured methodologies.
Collaborate with engineering teams to influence design specifications, qualification plans, and test coverage to ensure product robustness and mitigate early risks.
Establish and monitor key quality KPIs. Analyze manufacturing and field data to develop predictive models and drive continuous improvement in design and processes.
Act as the primary point for customer quality, managing escalations and integrating feedback. Oversee quality and corrective actions with suppliers, including RMA and PCN qualification.
Requirements
Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience.
Nice to have: Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field
Nice to have: Experience with Contract Manufacturing (CM) quality management
Nice to have: Data Center Operations and fleet Data Analysis
Nice to have: Experience leading successful cross-functional teams for continuous quality improvement
The Microelectronic Semiconductor Metals Process Engineer will provide senior fabrication support and technical direction for a wide range of metals processes and tools for semiconductor wafers.
Primary metals team leader responsible for all PVD and plasma clean processes, development, and associated metrology
Work closely with cross-functional teams in Process Engineering, Manufacturing, Quality, Integration, and R&D to ensure process stability, improve yield, high-volume ramp and drive continuous improvement initiatives
Mentor and train junior engineers and technicians on shift to support quality and delivery metrics for operations
Drive process improvements for new technology insertion to improve process robustness and achieve technology milestones for yield, reliability, and cost
Oversee and develop robust, manufacturable process recipes for Foundry customers in PVD, plasma cleans and bumping processes and the associated metrology and analysis using designs of experiments (DOEs) and industry standard methods
Requirements
Bachelor's Degree in Materials Science, or a related STEM field
Master’s degree in Materials Science, or a related STEM field
The CMOS Device and Process Integration Lead (MTS) will provide technical leadership across advanced technology development, from defining electrical targets and test-chip strategies to silicon-to-model correlation and line monitoring.
Responsibilities
Lead CMOS device and process-integration development, optimization, and characterization across advanced nodes, including FEOL, MOL, and BEOL interactions
Define technology targets, electrical acceptance criteria, characterization strategies, and silicon-to-model correlation requirements across technology maturity levels
Develop test structures, DOE and sampling strategies, and electrical monitors to quantify variability, detect process excursions, and improve process control
Partner with modeling, manufacturing, DTCO, and circuit-design teams to connect silicon capability, compact/interconnect models, design assumptions, and technology specifications
Apply statistical analysis, automation, and AI/ML methods to large electrical and process datasets to identify performance limiters, root causes, variability drivers, and opportunities for technology optimization
Requirements
M.S. or Ph.D. in Electrical Engineering, Physics, Materials Science, or a related semiconductor field
Work with a team of other process and equipment engineers responsible for starting up, developing and optimizing processes to improve product quality and reliability
Coordinate and carry out process, equipment and material evaluation/optimization to implement changes at process step
Lead and participate in yield improvement and cost reduction activities
Handle new process baseline qualifications and manage, audit and liaise with material suppliers
Conduct root cause investigation and failure analysis
Requirements
Master’s degree in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering or related field
The CMOS Device and Process Integration Lead (MTS) will provide technical leadership across advanced technology development, from defining electrical targets and test-chip strategies to silicon-to-model correlation and line monitoring.
Responsibilities
Lead CMOS device and process-integration development, optimization, and characterization across advanced nodes, including FEOL, MOL, and BEOL interactions
Define technology targets, electrical acceptance criteria, characterization strategies, and silicon-to-model correlation requirements across technology maturity levels
Develop test structures, DOE and sampling strategies, and electrical monitors to quantify variability, detect process excursions, and improve process control
Partner with modeling, manufacturing, DTCO, and circuit-design teams to connect silicon capability, compact/interconnect models, design assumptions, and technology specifications
Apply statistical analysis, automation, and AI/ML methods to large electrical and process datasets to identify performance limiters, root causes, variability drivers, and opportunities for technology optimization
Requirements
M.S. or Ph.D. in Electrical Engineering, Physics, Materials Science, or a related semiconductor field
Quality Assurance Engineer focused on continual improvement, defect prevention, and reduction of variation across supply chain and production operations.
Compensation
The starting pay range for this position is between $3,346 - 6,200 every 2 weeks.
Responsibilities
Contain defective products through ownership of problem definition (8D’s), Root Cause Analysis (RCA’s), dispositions review, tracking of resolution effectiveness, and Containment coordination
Detect non-conformances and process variations through use and standardization of Change Control management, and both Internal auditing and Layered Process auditing
Lead cross-functional problem-solving teams to drive process and product improvements
Guide form, fit, function, manufacturability, and durability through input at program development stages
Prevent customer satisfaction and durability issues by coordinating Failure Mode Effects Analysis (FMEA’s), product design specifications and tolerances reviews, past problem history, and supplier development
Process Integration Engineer responsible for starting up, developing and optimizing semiconductor manufacturing processes to improve product quality, yield, cost and reliability.
Responsibilities
Work with process and equipment engineers to improve product quality and reliability
Coordinate and carry out process, equipment and material evaluation/optimization
Lead and participate in yield improvement and cost reduction activities
Handle new process baseline qualifications and manage auditing with material suppliers
Conduct root cause investigation and failure analysis
Requirements
Master’s degree in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering or related field
Engineer responsible for industrializing cell assembly equipment from specification to stable production, managing supplier execution, and ensuring equipment readiness for production ramp.
Responsibilities
Own equipment industrialization for dry cell assembly processes
Translate process requirements into user requirement specifications and equipment specifications
Specify equipment for maintainability and fast recovery
Prepare RFQs and lead technical evaluation of supplier proposals
Manage supplier execution from design through delivery
Requirements
Bachelor’s degree in Mechanical Engineering or a related field
Own process development for dry cell assembly, identifying bottlenecks and implementing lasting solutions to ensure consistent, safe, and economic production.
Responsibilities
Own process development for dry cell assembly: electrode notching, stacking, hot pressing, cell assembly, short (hipot/insulation) testing, leak testing, vacuum baking.
Identify systemic bottlenecks and chronic yield losses across assembly processes using production data (MES, SPC, scrap Pareto, OEE).
Lead root-cause analysis with 8D, DOE, and other structured problem-solving methods.
Define critical process parameters and critical quality attributes and link them to cell performance, safety, and reliability.
Design and run DOEs at lab, pilot, and production scale to establish robust process windows.
Requirements
Bachelor’s or Master’s degree in Mechanical Engineering or a related field
Nice to have: LFP chemistry experience
Nice to have: Large-format prismatic cells experience
Engineer responsible for developing and scaling electrode manufacturing processes for lithium‑ion cells, ensuring quality, safety, and reliability across lab, pilot, and production scales.
Responsibilities
Own process development for electrode manufacturing
Identify and resolve yield bottlenecks
Design and run DOEs at lab, pilot, and production scale
Write process specifications and technology transfer packages
Support FAT, SAT, and process validation
Requirements
Bachelor’s or Master’s degree in Chemical Engineering or Electrochemistry
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