Conduct research in advanced power electronics packaging and power semiconductor modules, supporting externally funded projects and collaborating with faculty, students, industry partners, and research organizations.
Commensurate with education and experience.
- Conduct research in advanced power electronics packaging and power semiconductor modules
- Develop and evaluate advanced power module packaging concepts and technologies through modelling, simulation, fabrication, and experimental characterization
- Investigate electrical, thermal, mechanical, reliability, and manufacturability aspects of advanced power module packaging
- Contribute to externally funded research projects and collaborate with faculty, students, industry partners, and other research organizations
- Ph.D. in Electrical Engineering or a closely related field
- Nice to have: power module packaging materials and fabrication processes
- Nice to have: baseplates, substrates, die attach, soldering, sintering, wire/ribbon bonding, wire-bondless interconnects
- Nice to have: encapsulation
- Nice to have: curve-tracer characterization
- University contributions to health, dental, life and disability insurance
- Tuition waivers for employees and their families
- 12 official holidays
- Immediate leave accrual
- Choice of retirement programs with university contributions ranging from 5 to 10% of employee salary