Principal Engineer leading architecture, design, implementation, integration, and validation of next‑generation optical interconnect solutions for AI scale‑up and scale‑out platforms.
Responsibilities
Lead architecture, design, implementation, integration, and validation of CPO and NPO solutions
Define end‑to‑end system requirements for CPO and NPO implementations
Own technical development from feasibility to production readiness
Develop and maintain interface specifications
Lead integration of optical engines, electrical ICs, ASICs, packages, substrates, sockets, host boards, interposers, connectors, fibers, external laser sources, cooling solutions, and mechanical retention structures
Requirements
B.S. or M.S. in Electrical Engineering, Optical Engineering, Computer Engineering, Physics, Photonics, Applied Physics, or a related technical discipline
Ph.D. or equivalent industry experience is preferred
The Field Applications Engineer is responsible for technical support for customers PCB designers and manufacturing groups, interfacing with customers early in the design cycle to provide feedback on routing, layout, Signal Integrity, cost trade-off analysis, and material selection.
Locations (4)
Israel
New York, United States
California, United States
Colorado, United States
Compensation
Compensation for roles at TTM Technologies varies depending on a wide array of factors including but not limited to the specific office location, role, skill set and level of experience. As required by local law, TTM provides a reasonable range of compensation for roles that my be hired in New York, California and Colorado.
Lead multiple cross-functional teams in the design and verification of an industry-leading portfolio of Networking Ethernet switches.
Compensation
The total estimated annual compensation range for this position, inclusive of base salary, bonus, and equity, is $500,000 to $800,000. This range is a good faith estimate only. Bonus and equity are discretionary, subject to plan terms, and are not guaranteed components of total compensation. Actual total annual compensation may vary based on employee performance, company or equity performance, company policy, board approval, or similar factors.
Responsibilities
Provide technical guidance and directions to hardware engineers, to resolve complex HW bring-up and cross functional problems
HW schematic entry, Layout supervision, board bring-up, and cross functional system debug
Work with product management teams to translate high-level product direction into future system designs with detailed, executable steps for cross-functional teams.
Drive Vendor roadmaps of key components (ASICs, connectors, PCB vendors, etc.) to advance Arista’s HW designs, as well as align with internal product roadmaps
Communicate project status and changes to mitigate unexpected issues.
The Senior Field Applications Engineer is responsible for technical support for customers PCB designers and manufacturing groups, interfacing with customers early in the design cycle to provide feedback on routing, layout, signal integrity, cost trade-off analysis, material selection, and mechanical requirements.
Compensation
A reasonable estimate of the current range is: $109,841 - $193,168
Responsibilities
Educate customer designers and technologist on Design for Manufacture (DFM) and Design for Value (DFV)
Reduce customers’ design cycle time by facilitating/eliminating problem disposition between TTM’s pre-production engineering groups and the customer
Improve the quality and completeness of design packages coming from the customer by identifying design problems related to manufacturability and reliability test
Update customer designers and manufacturing groups on TTM capabilities and set roadmap/technology direction
Thorough understanding of TTM manufacturing capabilities and technologies to support QTA/NPI/High Volume Manufacturing
Requirements
Bachelor Degree in Engineering or related discipline
Design front‑end RF signal‑chain circuits and assemblies for space vehicle communication and signal analysis systems.
Compensation
Compensation: Base salary range is $100,000-130,000/year, depending on qualifications. SEAKR has very rich medical, dental and vision insurance plans, along with a generous 401(k) retirement plan. In addition to base salary, employees are eligible for a year-end bonus.
Responsibilities
Design front‑end RF signal‑chain circuits and assemblies for space vehicle communication and signal analysis systems using filters, amplifiers, mixers, couplers, impedance matching networks, and related components
Design stable, low‑phase noise oscillators and distribution networks
Design RF digitizer circuits and assemblies using multi‑GSPS ADC/DAC components
Cooperate with project teams over the course of RF system development to establish technical requirements, perform system trade studies, conduct design reviews, and track delivery schedule
Collaborate with RF group members and other SEAKR engineers to ensure that all multidisciplinary requirements can be satisfied in the assigned designs
Requirements
BSEE or equivalent university degree
Nice to have: Sampling and signal processing in digital RF systems
Educate customer designers and technologist on Design for Manufacture (DFM), Design for Value (DFV)
Reduce customers’ design cycle time by facilitating/eliminating problem disposition between TTM’s pre-production engineering groups and the customer
Improve the quality and completeness of design packages coming from the customer and help them by identifying design problems related to manufacturability and reliability test
Update customer designers and manufacturing groups on TTM capabilities. Set roadmap and technology direction through formal customer presentations.
Analyze customer designs for manufacturability, controlled impedance, and specification improvements
Requirements
Bachelor Degree in Engineering or related discipline
PMTS Hardware Development Eng.NewAdvanced Micro Devices, Inc · Santa Clara, US