- Melaka, Malaysia
- Senior
- 5–7 years
Lead the development and implementation of Digital Twin, Advanced Process Control (APC), and AI/ML solutions for semiconductor backend assembly and test manufacturing
Responsibilities
- Lead the development and implementation of Digital Twin, Advanced Process Control (APC), and AI/ML solutions for semiconductor backend assembly and test manufacturing
- Drive the transition from reactive process control to predictive, adaptive, and self-healing manufacturing through closed-loop automation
- Develop and deploy equipment and process Digital Twins to model equipment health, process behavior, performance, and future operating conditions
- Integrate data from equipment, sensors, process parameters, maintenance records, production systems, and quality data to support advanced analytics
- Apply AI/ML, statistical analysis, optimization techniques, and hybrid modeling to improve manufacturing performance and decision-making
Requirements
- Ph.D. / Master’s / Bachelor’s degree in Engineering, Physics, Computer Science, Data Science, Industrial Engineering, or a related technical field