- Naperville, Illinois, United States
- On-site
- Full-time
- $80K–$150K per year
- 3+ years
Lead the development of high-speed digital design for next-generation Co-Packaged Optics products, owning the high-speed electrical data path from concept to production and mentoring junior engineers.
Compensation
$80,000 - $150,000 base salary, plus annual bonus
Responsibilities
- Advance the development of 200G+ systems and interfaces for our NPO and CPO products, including 224G/448G PAM4 signal and power integrity (SIPI)
- Own technology selection, architecture, development, integration, and productization of cutting-edge CPO solutions
- Define PCB material selection and stack-ups, and evaluate S-parameters, eye diagrams, crosstalk, jitter, and COM performance
- Assess host (switch fabric and xPU) and optical technologies, including compute fabrics and scale-up/scale-out topologies
- Guide the electrical data path from concept to production, and mentor junior design team members
Requirements
- BS in Electrical Engineering